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The HDI PCB process is based on traditional double-sided boards as the core board, which are continuously stacked and laminated. This type of circuit board, which consists of a continuously stacked process, is also known as Build up Multilayer (BUM). Compared to traditional circuit boards, HDI PCBs have advantages such as being light, thin, short, and small.
The interlayer electrical interconnection of HDI PCBs is achieved through conductive through-hole, buried hole, and blind hole connections. Its structure is different from ordinary multi-layer circuit board processes. In the HDI PCB circuit board process, a large number of micro buried blind holes and laser direct drilling are used, while the standard PCB process usually uses mechanical drilling, so the number of layers and aspect ratio are often reduced compared to traditional standard PCBs. Compared to regular PCBs, the most significant feature of HDI PCBs is higher circuit density, smaller size, and lighter weight.
IPCB circuit provides high-precision HDI circuit board models and batch manufacturing, supporting fast milling of HDI PCB models. The following is the process capability table for iPCB circuits. Please feel free to contact us.