IC substrate, chip substrate, IC packaging substrate process capability

The IC substrate is mainly used to carry ICs (Integrated Circuit), with internal wiring to conduct signals between chips and circuit boards. In addition to its carrying function, the IC substrate also has additional functions such as protecting circuits, and dedicated lines, designing heat dissipation pathways, and establishing modular standards for components. 

IC substrates are developed based on HDI circuit boards, and there is a certain correlation between the two. However, the technological threshold of IC substrates is much higher than that of HDI circuit boards and ordinary PCB circuit boards. IC substrates can be understood as high-end PCBs, which have characteristics such as high density, high precision, high number of pins, high performance, miniaturization, and thinness. They require higher technical parameters, especially the core line width/line spacing parameters.